Heat treating beforehand to firm up HTPLA helps parts hold shape up to near melting (175C). Protect your investment in warm environments or push limits of application by exploring copper’s thermal conductivity.  There is not enough copper to be electrically conductive, sintered, or plated, but there is a noticeable difference in weight and heat transfer.

• Base resin: HTPLA – Heat Treatable PLA
• Additive: Real Copper Powder
• Particle size: less than 250 micron (0.25mm)
• Odor: low or no
• Density: Approx. 2.3 g/cc
• Length (500g): 97m (1.75mm) and 36m (2.85mm)
• Heat treating: 110C (225F) for 10 min or as required for desired result
• Total loss of stiffness (before heat treat): 50-60C (Tg)
• Total loss of stiffness (after heat treat): 150-175C (melting)
• Dimension change (before heat treat): 0% X/Y/Z
• Dimension change (after heat treat): 1.5% shrink X/Y and 1% growth Z typical but please calculate and confirm for your specific print and process

Printer settings:

• Speed: 10-20 mm/s 1st layer, 20-80 mm/s rest of part
• Nozzle Set-point: 185-215C (hottest on 1st layer for best adhesion)
• Nozzle Actual: maintain set-point, reduce speed if less than
• Nozzle Type: Standard or wear resistant for extended use
• Nozzle Diameter: 0.6mm or larger preferred, 0.4mm okay with 0.25mm minimum for experts
• Layer thickness: 0.15-0.20mm recommended for a balance of quality, reliability, and productivity
• Bed Temperature: Room-60C (over 60C can worsen warp)
• Bed Preparation: Elmers purple disappearing glue stick or your other favorite PLA surface preparation

This material has been flow optimized and has less moisture uptake than standard PLAs, however composites are still sometimes more tricky to print depending on hardware and software settings.  The main challenge is to keep mass flow up (larger nozzle + fast speed) and in a single direction (minimal retraction) to avoid heat soak.